About: Semiconductor device fabrication

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rdfs:label	Semiconductor device fabrication (en)
skos:broader	dbc:Electronics_manufacturing dbc:Industrial_processes dbc:MOSFETs dbc:Microtechnology dbc:Semiconductor_devices
skos:prefLabel	Semiconductor device fabrication (en)
prov:wasDerivedFrom	wikipedia-en:Category:Semiconductor_device_fabrication?oldid=952692364&ns=14
is dbo:wikiPageWikiLink of	dbr:Ampleon dbr:Beam_lead_technology dbr:Electron_beam-induced_current dbr:Electrostatic_spray-assisted_vapour_deposition dbr:Epitaxial_wafer dbr:Negative-bias_temperature_instability dbr:MOSIS dbr:Metalorganic_vapour-phase_epitaxy dbr:Monolayer_doping dbr:Hydride_vapour_phase_epitaxy dbr:Reliability_(semiconductor) dbr:Deal–Grove_model dbr:Deep_reactive-ion_etching dbr:Device_under_test dbr:Doping_(semiconductor) dbr:Integrated_circuit_packaging dbr:Integrated_device_manufacturer dbr:Microtechnology dbr:Lift-off_(microtechnology) dbr:List_of_semiconductor_fabrication_plants dbr:Novolak dbr:Smart_cut dbr:Sputter_deposition dbr:SEMI dbr:Chemical-mechanical_polishing dbr:Chemical_vapor_deposition dbr:Gate_count dbr:Low-energy_plasma-enhanced_chemical_vapor_deposition dbr:Remote_plasma dbr:Wafer_backgrinding dbr:Virtual_metrology dbr:Salicide dbr:Alexander_Coucoulas dbr:Epitaxy dbr:Gas_immersion_laser_doping dbr:Bow_and_warp_of_semiconductor_wafers_and_substrates dbr:Coordinatograph dbr:Cross_section_(electronics) dbr:Oramir dbr:Cleanroom dbr:Close-space_sublimation dbr:Front_end_of_line dbr:Furnace_anneal dbr:Hardmask dbr:Overlay_control dbr:Passivation_(chemistry) dbr:Planar_process dbr:Process_design_kit dbr:Through-silicon_via dbr:Microfabrication dbr:Micropipe dbr:Product_engineering dbr:Titanium_nitride dbr:Dark_current_spectroscopy dbr:Wafer_(electronics) dbr:Wedge_bonding dbr:Dry_etching dbr:Health_hazards_in_semiconductor_manufacturing_occupations dbr:Ion_beam_lithography dbr:Ion_beam_mixing dbr:Ion_implantation dbr:Ion_layer_gas_reaction dbr:Laser_chemical_vapor_deposition dbr:Laser_trimming dbr:Layer_(electronics) dbr:Plasma_etching dbr:Phosphosilicate_glass dbr:Advanced_silicon_etching dbr:Alfred_Y._Cho dbr:Drive-level_capacitance_profiling dbr:Ball_bonding dbr:Dicing_tape dbr:Die_preparation dbr:Diffusion_barrier dbr:Focused_ion_beam dbr:Foundry_model dbr:Glossary_of_microelectronics_manufacturing_terms dbr:Semiconductor_intellectual_property_core dbr:Physical_vapor_deposition dbr:Pulsed_laser_deposition dbr:Semiconductor_device_fabrication dbr:Semiconductor_fabrication_plant dbr:SECS/GEM dbr:RCA_clean dbr:Random_dopant_fluctuation dbr:Rapid_thermal_processing dbr:Reactive-ion_etching dbr:Resist_(semiconductor_fabrication) dbr:Restrictive_design_rules dbr:Atomic_layer_deposition dbr:Atomic_layer_etching dbr:Ion_beam dbr:Back_end_of_line dbr:Tetrakis(dimethylamido)titanium dbr:Probe_card dbr:Zyron dbr:High-Speed_SECS_Message_Services dbr:Modulation_doping dbr:Substrate_mapping dbr:Redistribution_layer dbr:B-staging dbr:Borophosphosilicate_glass dbr:Phenol_formaldehyde_resin dbr:Bruno_Murari dbr:Capacitance–voltage_profiling dbr:Chalcogenide_chemical_vapour_deposition dbr:Channel-stopper dbr:Klaiber's_law dbr:Product_binning dbr:Wire_bonding dbr:Metal-induced_crystallization dbr:Multi-project_wafer_service dbr:Selective_area_epitaxy dbr:Shallow_trench_isolation dbr:Silicon_on_insulator dbr:Silicon_on_sapphire dbr:Spreading_resistance_profiling dbr:Semiconductor_industry dbr:Vapour_phase_decomposition dbr:Wafer-scale_integration dbr:Etching_(microfabrication) dbr:FOUP dbr:Fabless_manufacturing dbr:IBM_airgap dbr:Ohmic_contact dbr:WaferCatalyst dbr:Three-dimensional_integrated_circuit dbr:Wafer_dicing dbr:Process_variation_(semiconductor) dbr:Plasma-enhanced_chemical_vapor_deposition dbr:Plasma-immersion_ion_implantation dbr:Plasma_ashing dbr:Plasma_cleaning dbr:Plasma_etcher dbr:Evaporation_(deposition) dbr:Thermosonic_bonding dbr:Molecular_layer_deposition dbr:Ultra-high-purity_steam_for_oxidation_and_annealing dbr:Polycide dbr:Semiconductor_industry_in_China dbr:Semiconductor_industry_in_Taiwan dbr:Wafer_bond_characterization dbr:Ultraviolet_thermal_processing dbr:Non-contact_wafer_testing dbr:Package_on_a_package dbr:Wafering dbr:SMIF_(interface) dbr:Wafer_testing dbr:PROLITH dbr:Ultrapure_water dbr:Wafer_fabrication dbr:Stress_migration dbr:Strained_silicon_directly_on_insulator dbr:Surface_activated_bonding dbr:Surface_growth dbr:Specification_for_human_interface_for_semiconductor_manufacturing_equipment dbr:Spin_coating dbr:Thermal_laser_epitaxy
is dct:subject of	dbr:Ampleon dbr:Beam_lead_technology dbr:Electron_beam-induced_current dbr:Electrostatic_spray-assisted_vapour_deposition dbr:Epitaxial_wafer dbr:Negative-bias_temperature_instability dbr:MOSIS dbr:Metalorganic_vapour-phase_epitaxy dbr:Monolayer_doping dbr:Hydride_vapour_phase_epitaxy dbr:Reliability_(semiconductor) dbr:Deal–Grove_model dbr:Deep_reactive-ion_etching dbr:Device_under_test dbr:Doping_(semiconductor) dbr:Integrated_circuit_packaging dbr:Integrated_device_manufacturer dbr:Microtechnology dbr:Lift-off_(microtechnology) dbr:List_of_semiconductor_fabrication_plants dbr:Novolak dbr:Smart_cut dbr:Sputter_deposition dbr:SEMI dbr:Chemical-mechanical_polishing dbr:Chemical_vapor_deposition dbr:Gate_count dbr:Low-energy_plasma-enhanced_chemical_vapor_deposition dbr:Remote_plasma dbr:Wafer_backgrinding dbr:Virtual_metrology dbr:Salicide dbr:Alexander_Coucoulas dbr:Epitaxy dbr:Gas_immersion_laser_doping dbr:Bow_and_warp_of_semiconductor_wafers_and_substrates dbr:Coordinatograph dbr:Cross_section_(electronics) dbr:Oramir dbr:Cleanroom dbr:Close-space_sublimation dbr:Front_end_of_line dbr:Furnace_anneal dbr:Hardmask dbr:Overlay_control dbr:Passivation_(chemistry) dbr:Planar_process dbr:Process_design_kit dbr:Through-silicon_via dbr:Microfabrication dbr:Micropipe dbr:Product_engineering dbr:Titanium_nitride dbr:Dark_current_spectroscopy dbr:Wafer_(electronics) dbr:Wedge_bonding dbr:Dry_etching dbr:Health_hazards_in_semiconductor_manufacturing_occupations dbr:Ion_beam_lithography dbr:Ion_beam_mixing dbr:Ion_implantation dbr:Ion_layer_gas_reaction dbr:Laser_chemical_vapor_deposition dbr:Laser_trimming dbr:Layer_(electronics) dbr:Plasma_etching dbr:Phosphosilicate_glass dbr:Advanced_silicon_etching dbr:Alfred_Y._Cho dbr:Drive-level_capacitance_profiling dbr:Ball_bonding dbr:Dicing_tape dbr:Die_preparation dbr:Diffusion_barrier dbr:Focused_ion_beam dbr:Foundry_model dbr:Glossary_of_microelectronics_manufacturing_terms dbr:Semiconductor_intellectual_property_core dbr:Physical_vapor_deposition dbr:Pulsed_laser_deposition dbr:Semiconductor_device_fabrication dbr:Semiconductor_fabrication_plant dbr:SECS/GEM dbr:RCA_clean dbr:Random_dopant_fluctuation dbr:Rapid_thermal_processing dbr:Reactive-ion_etching dbr:Resist_(semiconductor_fabrication) dbr:Restrictive_design_rules dbr:Atomic_layer_deposition dbr:Atomic_layer_etching dbr:Ion_beam dbr:Back_end_of_line dbr:Tetrakis(dimethylamido)titanium dbr:Probe_card dbr:Zyron dbr:High-Speed_SECS_Message_Services dbr:Modulation_doping dbr:Substrate_mapping dbr:Redistribution_layer dbr:B-staging dbr:Borophosphosilicate_glass dbr:Phenol_formaldehyde_resin dbr:Bruno_Murari dbr:Capacitance–voltage_profiling dbr:Chalcogenide_chemical_vapour_deposition dbr:Channel-stopper dbr:Klaiber's_law dbr:Product_binning dbr:Wire_bonding dbr:Metal-induced_crystallization dbr:Multi-project_wafer_service dbr:Selective_area_epitaxy dbr:Shallow_trench_isolation dbr:Silicon_on_insulator dbr:Silicon_on_sapphire dbr:Spreading_resistance_profiling dbr:Semiconductor_industry dbr:Vapour_phase_decomposition dbr:Wafer-scale_integration dbr:Etching_(microfabrication) dbr:FOUP dbr:Fabless_manufacturing dbr:IBM_airgap dbr:Ohmic_contact dbr:WaferCatalyst dbr:Three-dimensional_integrated_circuit dbr:Wafer_dicing dbr:Process_variation_(semiconductor) dbr:Plasma-enhanced_chemical_vapor_deposition dbr:Plasma-immersion_ion_implantation dbr:Plasma_ashing dbr:Plasma_cleaning dbr:Plasma_etcher dbr:Evaporation_(deposition) dbr:Thermosonic_bonding dbr:Molecular_layer_deposition dbr:Ultra-high-purity_steam_for_oxidation_and_annealing dbr:Polycide dbr:Semiconductor_industry_in_China dbr:Semiconductor_industry_in_Taiwan dbr:Wafer_bond_characterization dbr:Ultraviolet_thermal_processing dbr:Non-contact_wafer_testing dbr:Package_on_a_package dbr:Wafering dbr:SMIF_(interface) dbr:Wafer_testing dbr:PROLITH dbr:Ultrapure_water dbr:Wafer_fabrication dbr:Stress_migration dbr:Strained_silicon_directly_on_insulator dbr:Surface_activated_bonding dbr:Surface_growth dbr:Specification_for_human_interface_for_semiconductor_manufacturing_equipment dbr:Spin_coating dbr:Thermal_laser_epitaxy
is skos:broader of	dbc:Foundry_semiconductor_companies dbc:Chemical_vapour_deposition_precursors dbc:Lithography_(microfabrication) dbc:Silicon_wafer_producers dbc:Semiconductor_companies dbc:Packaging_(microfabrication) dbc:Fabless_semiconductor_companies dbc:Semiconductor_growth dbc:Semiconductor_fabrication_materials dbc:Nanoelectronics dbc:Equipment_semiconductor_companies dbc:Chemical_vapor_deposition dbc:Etching_(microfabrication) dbc:Semiconductor_fabrication_equipment