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About:
Redistribution layer
An Entity of Type:
Thing
,
from Named Graph:
http://dbpedia.org
,
within Data Space:
dbpedia.org
Layer used to relocate a microchip's contacts
Property
Value
dbo:
description
لایهای که برای جابجایی اتصالات ریزتراشه استفاده میشود
(fa)
layer used to relocate a microchip's contacts
(en)
dbo:
wikiPageExternalLink
https://web.archive.org/web/20160427064204/http:/flipchips.com/tutorial/assembly/redistribution-layers/
dbo:
wikiPageWikiLink
dbr
:Integrated_circuit
dbr
:Input/output
dbr
:Solder_ball
dbr
:Wire_bonding
dbr
:Die_(integrated_circuit)
dbr
:Thermal_stress
dbc
:Packaging_(microfabrication)
dbc
:Semiconductor_device_fabrication
dbp:
wikiPageUsesTemplate
dbt
:Reflist
dbt
:Short_description
dbt
:Electronics-stub
dct:
subject
dbc
:Packaging_(microfabrication)
dbc
:Semiconductor_device_fabrication
gold:
hypernym
dbr
:Layer
rdfs:
label
Redistribution layer
(en)
owl:
sameAs
freebase
:Redistribution layer
wikidata
:Redistribution layer
dbpedia-global
:Redistribution layer
prov:
wasDerivedFrom
wikipedia-en
:Redistribution_layer?oldid=1308058205&ns=0
foaf:
isPrimaryTopicOf
wikipedia-en
:Redistribution_layer
is
dbo:
wikiPageWikiLink
of
dbr
:Veeco
dbr
:List_of_semiconductor_fabrication_plants
dbr
:RDL
dbr
:Semiconductor_device_fabrication
dbr
:Three-dimensional_integrated_circuit
dbr
:Fan-out_wafer-level_packaging
dbr
:Glossary_of_microelectronics_manufacturing_terms
dbr
:List_of_integrated_circuit_packaging_types
is
foaf:
primaryTopic
of
wikipedia-en
:Redistribution_layer
This content was extracted from
Wikipedia
and is licensed under the
Creative Commons Attribution-ShareAlike 4.0 International