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- Thermosonic bonding is widely used to wire bond silicon integrated circuits into computers. Alexander Coucoulas was named "Father of Thermosonic Bonding" by George Harman, the world's foremost authority on wire bonding, where he referenced Coucoulas's leading edge publications in his book, Wire Bonding In Microelectronics. Owing to the well proven reliability of thermosonic bonds, it is extensively used to connect the central processing units (CPUs), which are encapsulated silicon integrated circuits that serve as the "brains" of today's computers. (en)
- 超音波熱圧着（ちょうおんぱねつあっちゃく、サーモソニックボンディング、Thermosonic bonding）とは、超音波接合の一種で超音波の印加と加熱を併用して接合する手法。 (ja)
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- incidence is normally used only in the singular form, perhaps incidents or incidence was intended (en)
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- Thermosonic bonding is widely used to wire bond silicon integrated circuits into computers. Alexander Coucoulas was named "Father of Thermosonic Bonding" by George Harman, the world's foremost authority on wire bonding, where he referenced Coucoulas's leading edge publications in his book, Wire Bonding In Microelectronics. Owing to the well proven reliability of thermosonic bonds, it is extensively used to connect the central processing units (CPUs), which are encapsulated silicon integrated circuits that serve as the "brains" of today's computers. (en)
- 超音波熱圧着（ちょうおんぱねつあっちゃく、サーモソニックボンディング、Thermosonic bonding）とは、超音波接合の一種で超音波の印加と加熱を併用して接合する手法。 (ja)
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- Enllaç termosònic (ca)
- 超音波熱圧着 (ja)
- Thermosonic bonding (en)
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