About: Ball grid array

Property	Value
dbo:description	تقنية توصيل الرقاقات (ar) typ obudowy układów scalonych w technologii montażu powierzchniowego (pl) форма корпусу інтегральної схеми, в котрій з’єднання для поверхневого монтажу компактно розташовані на нижній стороні компонента (uk) type of surface-mount packaging (en) type oppervlakmontage voor componenten (nl) tipo di package per circuiti integrati a montaggio superficiale (it) Gehäuseform von Integrierten Schaltungen, bei der die Anschlüsse für SMD-Bestückung kompakt auf der Unterseite des Bauelements liegen (de) نوعی بسته‌بندی نصب-سطحی (fa) 應用於集成電路上的一種封裝技術 (zh)
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dbp:date	2019-01-02 (xsd:date)
dbp:url	https://web.archive.org/web/20190102095019/https:/c44f5d406df450f4a66b-1b94a87d576253d9446df0a9ca62e142.ssl.cf2.rackcdn.com/2015/03/PBGA-J-Devices-DSJD401.pdf
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dct:subject	dbc:Chip_carriers
gold:hypernym	dbr:Packaging
rdfs:label	Ball grid array (en) شبكة كرات مصفوفة (ar) Ball grid array (ca) Ball grid array (cs) Ball Grid Array (de) Ball grid array (es) Ball grid array (it) Matrice de billes (fr) 볼 그리드 배열 (ko) Ball Grid Array (pl) Ball grid array (nl) BGA (ru) BGA (pt) BGA (uk) Ball Grid Array (sv) 球柵陣列封裝 (zh)
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