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Digital image correlation analyses have applications in material property characterization, displacement measurement, and strain mapping. As such, DIC is becoming an increasingly popular tool when evaluating the thermo-mechanical behavior of electronic components and systems.

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  • Digital image correlation analyses have applications in material property characterization, displacement measurement, and strain mapping. As such, DIC is becoming an increasingly popular tool when evaluating the thermo-mechanical behavior of electronic components and systems. (en)
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  • Digital image correlation analyses have applications in material property characterization, displacement measurement, and strain mapping. As such, DIC is becoming an increasingly popular tool when evaluating the thermo-mechanical behavior of electronic components and systems. (en)
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  • Digital image correlation for electronics (en)
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