dbo:abstract
|
- TO-66 is a type of semiconductor package for devices with three connections, such as transistors. The shape is similar to the TO-3 package, but the size is smaller. The TO-66 package is made entirely of metal and is commonly used by silicon controlled rectifiers and power transistors.In Europe, it was popularly used by the complementary germanium power transistors AD161/AD162. The TO-66 package consists of a diamond-shaped base plate with diagonals of 31.4 mm (1.24 in) and 19.0 mm (0.75 in). The plate has two mounting holes on the long diagonal, with the centers spaced 23 mm (0.91 in) apart. A cap attached to one side of the plate and under which the semiconductor chip is located, brings the total height to up to 8.63 mm (0.340 in). Two pins on the other side of the plate are isolated from the package by individual glass-metal seals. The metal case forms the third connection (in the case of a bipolar junction transistor this is typically the collector). (en)
|
dbo:thumbnail
| |
dbo:wikiPageExternalLink
| |
dbo:wikiPageID
| |
dbo:wikiPageLength
|
- 6231 (xsd:nonNegativeInteger)
|
dbo:wikiPageRevisionID
| |
dbo:wikiPageWikiLink
| |
dbp:wikiPageUsesTemplate
| |
dcterms:subject
| |
gold:hypernym
| |
rdf:type
| |
rdfs:comment
|
- TO-66 is a type of semiconductor package for devices with three connections, such as transistors. The shape is similar to the TO-3 package, but the size is smaller. The TO-66 package is made entirely of metal and is commonly used by silicon controlled rectifiers and power transistors.In Europe, it was popularly used by the complementary germanium power transistors AD161/AD162. (en)
|
rdfs:label
| |
owl:differentFrom
| |
owl:sameAs
| |
prov:wasDerivedFrom
| |
foaf:depiction
| |
foaf:isPrimaryTopicOf
| |
is dbo:wikiPageRedirects
of | |
is dbo:wikiPageWikiLink
of | |
is foaf:primaryTopic
of | |