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HASL or HAL (for hot air (solder) leveling) is a type of finish used on printed circuit boards (PCBs). The PCB is typically dipped into a bath of molten solder so that all exposed copper surfaces are covered by solder. Excess solder is removed by passing the PCB between hot air knives. HASL can be applied with or without lead (Pb), but only lead-free HASL is RoHS compliant.

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  • HASL or HAL (for hot air (solder) leveling) is a type of finish used on printed circuit boards (PCBs). The PCB is typically dipped into a bath of molten solder so that all exposed copper surfaces are covered by solder. Excess solder is removed by passing the PCB between hot air knives. HASL can be applied with or without lead (Pb), but only lead-free HASL is RoHS compliant. (en)
  • 热风焊锡整平(英語:Hot Air Solder Leveling,HASL),又称热风整平(英語:Hot Air Leveling,HSL),俗称喷锡,是印刷电路板生产工艺的其中一步。 该步骤通常将预制电路板浸入盛有熔化焊锡池中,将裸露的铜表面用焊锡覆盖。 然后再使用热风切刀将多余的焊料清除。 (zh)
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  • HASL or HAL (for hot air (solder) leveling) is a type of finish used on printed circuit boards (PCBs). The PCB is typically dipped into a bath of molten solder so that all exposed copper surfaces are covered by solder. Excess solder is removed by passing the PCB between hot air knives. HASL can be applied with or without lead (Pb), but only lead-free HASL is RoHS compliant. (en)
  • 热风焊锡整平(英語:Hot Air Solder Leveling,HASL),又称热风整平(英語:Hot Air Leveling,HSL),俗称喷锡,是印刷电路板生产工艺的其中一步。 该步骤通常将预制电路板浸入盛有熔化焊锡池中,将裸露的铜表面用焊锡覆盖。 然后再使用热风切刀将多余的焊料清除。 (zh)
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  • Hot air solder leveling (en)
  • 喷锡 (zh)
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