About: Flat no-leads package

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Flat no-leads packages such as quad-flat no-leads (QFN) and dual-flat no-leads (DFN) physically and electrically connect integrated circuits to printed circuit boards. Flat no-leads, also known as micro leadframe (MLF) and SON (small-outline no leads), is a surface-mount technology, one of several package technologies that connect ICs to the surfaces of PCBs without through-holes. Flat no-lead is a near chip scale plastic encapsulated package made with a planar copper lead frame substrate. Perimeter lands on the package bottom provide electrical connections to the PCB. Flat no-lead packages include an exposed thermally conductive pad to improve heat transfer out of the IC (into the PCB). Heat transfer can be further facilitated by metal vias in the thermal pad. The QFN package is similar t

Attributes	Values
rdfs:label	QFN (ca) Quad Flat No Leads Package (de) Quad Flat No-leads package (fr) Flat no-leads package (en) Quad Flat No leads (pt) QFN (ru)
rdfs:comment	QFN (acrònim de Quad-FLat No-leads) és un tipus d'encapsulat de circuit integrat dintre de la tecnologia de muntatge superficial o SMT. A diferència de l'encapsulat QFP, no té terminals de connexió com es pot veure a la Fig.1, la qual cosa suposa una reducció de mida important. També es pot anomenar MLP(Micro Leadframe). QFN està definit per la norma MO-220 de l'organisme de normalització de semiconductors JEDEC. (ca) Um encapsulamento Quad Flat No leads (ou QFN) é um encapsulamento de circuitos integrados usado em montagem superficial de PCBs. Este tipo de encapsulamento é semelhante ao QFP, mas os terminais não se projetam dos lados do encapsulamento; em vez disso, os terminais ficam na parte inferior do componente. (pt) Quad Flat No Leads Package (QFN), auch als Micro Lead Frame (MLF) bezeichnet, ist eine in der Elektronik gebräuchliche Chipgehäusebauform für integrierte Schaltungen (IC). Die Bezeichnung umfasst unterschiedliche Größen von IC-Gehäusen welche alle als oberflächenmontierte Bauteile auf Leiterplatten gelötet werden. (de) Flat no-leads packages such as quad-flat no-leads (QFN) and dual-flat no-leads (DFN) physically and electrically connect integrated circuits to printed circuit boards. Flat no-leads, also known as micro leadframe (MLF) and SON (small-outline no leads), is a surface-mount technology, one of several package technologies that connect ICs to the surfaces of PCBs without through-holes. Flat no-lead is a near chip scale plastic encapsulated package made with a planar copper lead frame substrate. Perimeter lands on the package bottom provide electrical connections to the PCB. Flat no-lead packages include an exposed thermally conductive pad to improve heat transfer out of the IC (into the PCB). Heat transfer can be further facilitated by metal vias in the thermal pad. The QFN package is similar t (en) En électronique, le Quad Flat No-leads package (QFN) et le Dual-Flat No-leads (DFN) sont des types de boîtier de circuit intégré plats et sans broches qui relient physiquement et électriquement les circuits intégrés au circuit imprimé. La technologie de ce type de boîtier plat sans broches, connue aussi comme le MLF (micro leadframe) ou le SON (small-outline no leads), concerne les composants montés en surface, l'une des technologies de boîtiers qui relient les circuits intégrés à la surface des circuits imprimés sans trous traversants. (fr) QFN (от англ. Quad Flat No-leads package) — семейство корпусов микросхем, имеющих планарные выводы, расположенные непосредственно под микросхемой по всем четырём сторонам. Корпус имеет квадратную форму, размер которых определяется количеством выводов. Микросхемы в таких корпусах предназначены только для поверхностного монтажа; установка в разъём или монтаж в отверстия штатно не предусмотрен, хотя переходные коммутационные устройства существуют. (ru)
foaf:depiction
dcterms:subject	Chip carriers
Wikipage page ID	5663760 (xsd:integer)
Wikipage revision ID	1112722331 (xsd:integer)
Link from a Wikipage to another Wikipage	Electronics Solder Temperature cycling Deformation (mechanics) Via (electronics) Integrated circuit JEDEC List of integrated circuit packaging types Quad-flat package OEM Quad flat package Coefficient of thermal expansion Copper conductor Chip carrier THT Lead frame Amkor Technology Chip carriers Ball grid array Texas Instruments Solder fatigue Solder bridging Thousandth of an inch Weibull distribution IPC (electronics) Microchip Technology National Semiconductor Reflow Soldering Shear stress Electronics manufacturing services Wire bonding Moisture sensitivity level Small-outline integrated circuit Surface-mount technology Finite element method Solder mask Thermally conductive pad Chip scale package Surface mount technology
Link from a Wikipage to an external page	http://www.chipscalereview.com/issues/0107/index.php http://www.onsemi.com/pub/Collateral/AND8086-D.PDF https://amkor.com/packaging/leadframe/microleadframe/ https://amkor.com/technology/edge-protection/ http://cds.linear.com/docs/en/packaging/Carsem%20MLP%20users%20guide.pdf https://web.archive.org/web/20110930184744/http:/www.chipscalereview.com/issues/0107/index.php
sameAs	Flat no-leads package Flat no-leads package Flat no-leads package Flat no-leads package Flat no-leads package Flat no-leads package Flat no-leads package Flat no-leads package
dbp:wikiPageUsesTemplate	dbt:Semiconductor_packages dbt:Redirect dbt:Reflist dbt:Short_description dbt:Webarchive
thumbnail	wiki-commons:Special:FilePath/28_pin_MLP_integrated_circuit.jpg?width=300
date	2011-09-30 (xsd:date)
url	https://web.archive.org/web/20110930184744/http:/www.chipscalereview.com/issues/0107/index.php
has abstract	QFN (acrònim de Quad-FLat No-leads) és un tipus d'encapsulat de circuit integrat dintre de la tecnologia de muntatge superficial o SMT. A diferència de l'encapsulat QFP, no té terminals de connexió com es pot veure a la Fig.1, la qual cosa suposa una reducció de mida important. També es pot anomenar MLP(Micro Leadframe). QFN està definit per la norma MO-220 de l'organisme de normalització de semiconductors JEDEC. (ca) Quad Flat No Leads Package (QFN), auch als Micro Lead Frame (MLF) bezeichnet, ist eine in der Elektronik gebräuchliche Chipgehäusebauform für integrierte Schaltungen (IC). Die Bezeichnung umfasst unterschiedliche Größen von IC-Gehäusen welche alle als oberflächenmontierte Bauteile auf Leiterplatten gelötet werden. Als wesentliches Merkmal und im Gegensatz zu den ähnlichen Quad Flat Package (QFP) ragen die elektrischen Anschlüsse (Pins) nicht seitlich über die Abmessungen der Kunststoffummantelung hinaus, sondern sind in Form von nicht verzinnten Kupferanschlüssen plan in die Unterseite des Gehäuses integriert. Dadurch kann der benötigte Platz auf der Leiterplatte reduziert und eine höhere Packungsdichte erreicht werden. (de) Flat no-leads packages such as quad-flat no-leads (QFN) and dual-flat no-leads (DFN) physically and electrically connect integrated circuits to printed circuit boards. Flat no-leads, also known as micro leadframe (MLF) and SON (small-outline no leads), is a surface-mount technology, one of several package technologies that connect ICs to the surfaces of PCBs without through-holes. Flat no-lead is a near chip scale plastic encapsulated package made with a planar copper lead frame substrate. Perimeter lands on the package bottom provide electrical connections to the PCB. Flat no-lead packages include an exposed thermally conductive pad to improve heat transfer out of the IC (into the PCB). Heat transfer can be further facilitated by metal vias in the thermal pad. The QFN package is similar to the quad-flat package (QFP), and a ball grid array (BGA). (en) En électronique, le Quad Flat No-leads package (QFN) et le Dual-Flat No-leads (DFN) sont des types de boîtier de circuit intégré plats et sans broches qui relient physiquement et électriquement les circuits intégrés au circuit imprimé. La technologie de ce type de boîtier plat sans broches, connue aussi comme le MLF (micro leadframe) ou le SON (small-outline no leads), concerne les composants montés en surface, l'une des technologies de boîtiers qui relient les circuits intégrés à la surface des circuits imprimés sans trous traversants. Les QFN et DFN sont des boîtiers en plastique avec une grille de connexion plane en cuivre, très proches des dimensions de la puce interne. Les plages situées sur le périmètre inférieur du boîtier permettent une connexion électrique au circuit imprimé. Une plage centrale thermique au centre du boîtier est prévue pour faciliter le transfert de chaleur du circuit intégré vers le circuit imprimé. Le transfert de chaleur peut être encore amélioré par des vias métalliques dans la plage thermique. Le boîtier QFN est similaire aux boîtiers QFP et BGA. (fr) Um encapsulamento Quad Flat No leads (ou QFN) é um encapsulamento de circuitos integrados usado em montagem superficial de PCBs. Este tipo de encapsulamento é semelhante ao QFP, mas os terminais não se projetam dos lados do encapsulamento; em vez disso, os terminais ficam na parte inferior do componente. (pt) QFN (от англ. Quad Flat No-leads package) — семейство корпусов микросхем, имеющих планарные выводы, расположенные непосредственно под микросхемой по всем четырём сторонам. Корпус имеет квадратную форму, размер которых определяется количеством выводов. Микросхемы в таких корпусах предназначены только для поверхностного монтажа; установка в разъём или монтаж в отверстия штатно не предусмотрен, хотя переходные коммутационные устройства существуют. Шаг между выводами: 1.0, 0.8, 0.65, 0.5, 0.4, 0,35 мм.По центру микросхемы иногда имеется площадка для припаивания к печатной плате, с целью теплоотвода и дополнительного контакта с землей. Во время выполнения нагрева QFN корпусов при их монтаже, несмотря на отсутствие расслаивания, может происходить значительная деформация корпуса микросхемы. Из-за этого возможен отрыв припоя от контактных площадок. Для борьбы с таким явлением рекомендуется обращаться с микросхемами как с чувствительными к влажности уровня MSL 3 и более. (ru)
prov:wasDerivedFrom	wikipedia-en:Flat_no-leads_package?oldid=1112722331&ns=0
page length (characters) of wiki page	15499 (xsd:nonNegativeInteger)
foaf:isPrimaryTopicOf	wikipedia-en:Flat_no-leads_package
is Link from a Wikipage to another Wikipage of	Quad Flat No-leads package Quad flat no-leads package Quad-flat no-leads package Quad flat no leads package Allwinner Technology Dual Flat No Lead HVQFN Micro Leadframe Package Dual Flat No-leads package

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