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Statements

Subject Item
dbr:Thermosonic_bonding
rdfs:label
超音波熱圧着 Enllaç termosònic Thermosonic bonding
rdfs:comment
超音波熱圧着（ちょうおんぱねつあっちゃく、サーモソニックボンディング、Thermosonic bonding）とは、超音波接合の一種で超音波の印加と加熱を併用して接合する手法。 Thermosonic bonding is widely used to wire bond silicon integrated circuits into computers. Alexander Coucoulas was named "Father of Thermosonic Bonding" by George Harman, the world's foremost authority on wire bonding, where he referenced Coucoulas's leading edge publications in his book, Wire Bonding In Microelectronics. Owing to the well proven reliability of thermosonic bonds, it is extensively used to connect the central processing units (CPUs), which are encapsulated silicon integrated circuits that serve as the "brains" of today's computers.
foaf:depiction
n14:Integrated_circuit_wire_bonded.png
dcterms:subject
dbc:Semiconductor_device_fabrication dbc:Packaging_(microfabrication)
dbo:wikiPageID
26109619
dbo:wikiPageRevisionID
1108563743
dbo:wikiPageWikiLink
dbr:Thermocompression_bonding dbr:Transistor dbc:Semiconductor_device_fabrication dbr:Light-emitting_diodes dbr:Semiconductor_device_fabrication dbr:Flip_chip dbr:Recrystallization_(metallurgy) dbr:Alexander_Coucoulas dbr:Ultrasonic_welding dbr:Josephson_effect dbr:Central_processing_unit dbr:Cold_working dbr:Integrated_circuits dbr:SQUID dbr:Hot_working dbr:Integrated_circuit dbr:LED_lamps dbc:Packaging_(microfabrication) n18:Integrated_circuit_wire_bonded.png dbr:Piezoelectricity
owl:sameAs
freebase:m.0bbxpf0 n15:4wgG5 dbpedia-ja:超音波熱圧着 dbpedia-ca:Enllaç_termosònic wikidata:Q7783252
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dbt:Short_description dbt:Reflist dbt:Verify_spelling
dbo:thumbnail
n14:Integrated_circuit_wire_bonded.png?width=300
dbp:date
September 2022
dbp:reason
incidence is normally used only in the singular form, perhaps incidents or incidence was intended
dbo:abstract
Thermosonic bonding is widely used to wire bond silicon integrated circuits into computers. Alexander Coucoulas was named "Father of Thermosonic Bonding" by George Harman, the world's foremost authority on wire bonding, where he referenced Coucoulas's leading edge publications in his book, Wire Bonding In Microelectronics. Owing to the well proven reliability of thermosonic bonds, it is extensively used to connect the central processing units (CPUs), which are encapsulated silicon integrated circuits that serve as the "brains" of today's computers. 超音波熱圧着（ちょうおんぱねつあっちゃく、サーモソニックボンディング、Thermosonic bonding）とは、超音波接合の一種で超音波の印加と加熱を併用して接合する手法。
prov:wasDerivedFrom
wikipedia-en:Thermosonic_bonding?oldid=1108563743&ns=0
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8263
foaf:isPrimaryTopicOf
wikipedia-en:Thermosonic_bonding