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Statements

Subject Item
dbr:Dicing_tape
rdf:type
dbo:Album
rdfs:label
Dicing tape Sägefolie
rdfs:comment
Dicing tape is a backing tape used during wafer dicing or some other microelectronic substrate separation, the cutting apart of pieces of semiconductor or other material following wafer or module microfabrication. The tape holds the pieces of the substrate, in case of a wafer called as die, together during the cutting process, mounting them to a thin metal frame. The dies/substrate pieces are removed from the dicing tape later on in the electronics manufacturing process.
foaf:depiction
n16:A_semiconductor_wafer_on_a_dicing_(blue)_tape._Few_chips_(dies)_from_the_wafer_have_already_been_picked_up_(removed)_for_further_manufacturing.png
dcterms:subject
dbc:Semiconductor_device_fabrication
dbo:wikiPageID
28132162
dbo:wikiPageRevisionID
1086036585
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dbr:Microfabrication dbr:Polyethylene dbr:PVC dbr:Electronics dbr:Furukawa_Electric dbr:Polyolefin dbr:Wafer_dicing dbr:Printed_circuit_board dbc:Semiconductor_device_fabrication dbr:Semiconductor dbr:Wafer_(electronics) n21:A_semiconductor_wafer_on_a_dicing_(blue)_tape._Few_chips_(dies)_from_the_wafer_have_already_been_picked_up_(removed)_for_further_manufacturing.png
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n16:A_semiconductor_wafer_on_a_dicing_(blue)_tape._Few_chips_(dies)_from_the_wafer_have_already_been_picked_up_(removed)_for_further_manufacturing.png?width=300
dbo:abstract
Dicing tape is a backing tape used during wafer dicing or some other microelectronic substrate separation, the cutting apart of pieces of semiconductor or other material following wafer or module microfabrication. The tape holds the pieces of the substrate, in case of a wafer called as die, together during the cutting process, mounting them to a thin metal frame. The dies/substrate pieces are removed from the dicing tape later on in the electronics manufacturing process.
gold:hypernym
dbr:Tape
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wikipedia-en:Dicing_tape?oldid=1086036585&ns=0
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3962
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wikipedia-en:Dicing_tape