An Entity of Type: Person100007846, from Named Graph: http://dbpedia.org, within Data Space: dbpedia.org

The multi-leaded power package is a style of electronic component package, commonly used for high power integrated circuits, especially for monolithic audio amplifiers. It was derived from single in-line package. The difference is the lead arrangement; multi-leaded power packages usually have the lead bent to zig-zag pattern. Multi-leaded power packages commonly have more than three leads; nine-, thirteen- and fifteen-lead units are common, units with five or seven leads with TO-220 style are also manufactured. A notable characteristic is a metal tab with a hole, used in mounting the case to a heatsink. The physical view of multi-leaded power packages are simply stretched TO-220 packages. Components made in multi-leaded power packages can handle more power than those constructed in TO-220

Property Value
dbo:abstract
  • The multi-leaded power package is a style of electronic component package, commonly used for high power integrated circuits, especially for monolithic audio amplifiers. It was derived from single in-line package. The difference is the lead arrangement; multi-leaded power packages usually have the lead bent to zig-zag pattern. Multi-leaded power packages commonly have more than three leads; nine-, thirteen- and fifteen-lead units are common, units with five or seven leads with TO-220 style are also manufactured. A notable characteristic is a metal tab with a hole, used in mounting the case to a heatsink. The physical view of multi-leaded power packages are simply stretched TO-220 packages. Components made in multi-leaded power packages can handle more power than those constructed in TO-220 cases, or even TO3 cases with thermal resistance no less than 1.5 C/W. One well-known STMicroelectronics brand of this type of package is Multiwatt. (en)
dbo:thumbnail
dbo:wikiPageID
  • 22282608 (xsd:integer)
dbo:wikiPageLength
  • 3367 (xsd:nonNegativeInteger)
dbo:wikiPageRevisionID
  • 943251656 (xsd:integer)
dbo:wikiPageWikiLink
dct:subject
gold:hypernym
rdf:type
rdfs:comment
  • The multi-leaded power package is a style of electronic component package, commonly used for high power integrated circuits, especially for monolithic audio amplifiers. It was derived from single in-line package. The difference is the lead arrangement; multi-leaded power packages usually have the lead bent to zig-zag pattern. Multi-leaded power packages commonly have more than three leads; nine-, thirteen- and fifteen-lead units are common, units with five or seven leads with TO-220 style are also manufactured. A notable characteristic is a metal tab with a hole, used in mounting the case to a heatsink. The physical view of multi-leaded power packages are simply stretched TO-220 packages. Components made in multi-leaded power packages can handle more power than those constructed in TO-220 (en)
rdfs:label
  • Multi-leaded power package (en)
owl:sameAs
prov:wasDerivedFrom
foaf:depiction
foaf:isPrimaryTopicOf
is dbo:wikiPageRedirects of
is dbo:wikiPageWikiLink of
is foaf:primaryTopic of
Powered by OpenLink Virtuoso    This material is Open Knowledge     W3C Semantic Web Technology     This material is Open Knowledge    Valid XHTML + RDFa
This content was extracted from Wikipedia and is licensed under the Creative Commons Attribution-ShareAlike 3.0 Unported License