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- Zig-zag in-line package fou un tipus d'encapsulat de circuit integrat de curta vida, particularment usat en xips de memòries RAM dinàmiques. S'esperava que reemplacessin els Dual in-line package (DIP), però no va ser així. És un circuit integrat encapsulat en un tros de plàstic, amb unes mides aproximades de 3 mm x 30 mm x 10 mm. Els pins del conjunt sobresurten en dues files. Aquests pins són inserits en forats a la targeta de circuit imprès. Han estat reemplaçats pels usats en les memòries SIMM i DIMM. (ca)
- Zig-zag in-line package o "ZIP" es una forma de encapsulado para circuitos integrados, que se caracteriza por disponer de una serie de pines que se alternan para formar 2 filas separadas en zigzag, con unas medidas aproximadas de 3 mm x 30 mm x 10 mm.
* Chips tipo ZIP en sus zócalos
* Chips ZIP
* Encapsulado ZIP Son comúnmente vistos para aplicaciones de potencia, en los que el circuito integrado puede alcanzar elevadas temperaturas. Presentan una o varias perforaciones practicadas sobre el cuerpo de la pastilla del encapsulado, para permitir su acoplamiento con tornillos a disipadores verticales, o sobre la cara interior de las carcasas. Ejemplos de IC's en ZIP son controladores y convertidores de señal en televisores de tubo, controladores de motores paso a paso, amplificadores de audio, etcétera. Particularmente para chips de memorias RAM dinámicas en ordenadores, no resultó ser popular; se esperaba que reemplazase a los Dual in-line package (DIP), pero fueron reemplazados muy rápidamente por los de las memorias SIMM y DIMM.
* Datos: Q3776137
* Multimedia: Zig-zag in-line package / Q3776137 (es)
- The zig-zag in-line package (ZIP) is a packaging technology for integrated circuits. It was intended as a replacement for dual in-line packaging (DIL or DIP). A ZIP is an integrated circuit encapsulated in a slab of plastic with 16, 20, 28 or 40 pins, measuring (for the ZIP-20 package) about 3 mm x 30 mm x 10 mm. The package's pins protrude in two rows from one of the long edges. The two rows are staggered by 1.27 mm (0.05"), giving them a zig-zag appearance, and allowing them to be spaced more closely than a rectangular grid would allow. The pins are inserted into holes in a printed circuit board, with the packages standing at right-angles to the board, allowing them to be placed closer together than DIPs of the same size. ZIPs have now been superseded by surface-mount packages such as the thin small-outline packages (TSOPs), but are still in use. The quad in-line package uses a smilar staggered semiconductor package design. High-power devices (such as high-voltage op-amp ICs, voltage regulators, and motor driver ICs) are still being manufactured in a package with a zig-zag pinout (and normally screwed onto a heatsink). These zig-zag packages include variations on the TO220 such as "TO220S", "staggered leads TO-220-11", "staggered leads TO-220-15", and HZIP. The trademarks Pentawatt or Hexawatt are also used for chips in multi-leaded power packages like TDA2002/2003/2020/2030 and L200.
* ZIP chips in ZIP sockets
* ZIP chips As for computers, dynamic RAM ZIP chips are now only to be found in obsolete computers, some of these are:
* Commodore Amiga 500 expansion packs
* Commodore Amiga 3000 on-board memory and some expansion boards
* Commodore CDTV on-board memory
* Acorn Archimedes 300 and 400 series on-board memory
* Acorn Archimedes A3010 and A3020 (en)
- O zig-zag in-line package ou ZIP foi uma tecnologia de encapsulamento de circuitos integrados (particularmente chips DRAM) que não chegou a se firmar como padrão de mercado. Foi pensada como uma substituta do padrão (ou DIL). (pt)
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- Zig-zag in-line package fou un tipus d'encapsulat de circuit integrat de curta vida, particularment usat en xips de memòries RAM dinàmiques. S'esperava que reemplacessin els Dual in-line package (DIP), però no va ser així. És un circuit integrat encapsulat en un tros de plàstic, amb unes mides aproximades de 3 mm x 30 mm x 10 mm. Els pins del conjunt sobresurten en dues files. Aquests pins són inserits en forats a la targeta de circuit imprès. Han estat reemplaçats pels usats en les memòries SIMM i DIMM. (ca)
- O zig-zag in-line package ou ZIP foi uma tecnologia de encapsulamento de circuitos integrados (particularmente chips DRAM) que não chegou a se firmar como padrão de mercado. Foi pensada como uma substituta do padrão (ou DIL). (pt)
- Zig-zag in-line package o "ZIP" es una forma de encapsulado para circuitos integrados, que se caracteriza por disponer de una serie de pines que se alternan para formar 2 filas separadas en zigzag, con unas medidas aproximadas de 3 mm x 30 mm x 10 mm.
* Chips tipo ZIP en sus zócalos
* Chips ZIP
* Encapsulado ZIP
* Datos: Q3776137
* Multimedia: Zig-zag in-line package / Q3776137 (es)
- The zig-zag in-line package (ZIP) is a packaging technology for integrated circuits. It was intended as a replacement for dual in-line packaging (DIL or DIP). A ZIP is an integrated circuit encapsulated in a slab of plastic with 16, 20, 28 or 40 pins, measuring (for the ZIP-20 package) about 3 mm x 30 mm x 10 mm. The package's pins protrude in two rows from one of the long edges. The two rows are staggered by 1.27 mm (0.05"), giving them a zig-zag appearance, and allowing them to be spaced more closely than a rectangular grid would allow. The pins are inserted into holes in a printed circuit board, with the packages standing at right-angles to the board, allowing them to be placed closer together than DIPs of the same size. ZIPs have now been superseded by surface-mount packages such as th (en)
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- Zig-zag in-line package (ca)
- Zig-zag in-line package (es)
- Zig-zag in-line package (pt)
- Zig-zag in-line package (en)
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