| dbo:abbreviation
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- Wissenschaftliche Fachzeitschrift (de)
- Scientific journal (en)
- ساینَسی رِسالہٕ (ks)
- revue scientifique (fr)
- vědecký časopis (cs)
- revista científica (es)
- rivista scientifica (it)
- wetenschappelijk tijdschrift van Institute of Electrical and Electronics Engineers (nl)
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| dbo:finalPublicationYear
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| dbo:firstPublicationYear
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| dbo:issn
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| dbo:lccn
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| dbo:oclc
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| dbo:wikiPageExternalLink
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| dbp:abbreviation
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- IEEE Trans. Adv. Packag. (en)
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| dbp:coden
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| dbp:discipline
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- Multi-chip modules, wafer-scale integration (en)
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| dbp:editor
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| dbp:formernames
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- IEEE Transactions on Components and Packaging Technologies, IEEE Transactions on Electronics Packaging Manufacturing (en)
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| dbp:frequency
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| dbp:history
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| dbp:impact
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| dbp:impactYear
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| dbp:issn
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| dbp:lccn
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| dbp:oclc
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| dbp:publisher
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| dbp:title
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- IEEE Transactions on Advanced Packaging (en)
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| dbp:website
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| dbp:wikiPageUsesTemplate
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| dct:subject
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| gold:hypernym
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| rdf:type
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| rdfs:label
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- IEEE Transactions on Advanced Packaging (en)
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| owl:sameAs
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| prov:wasDerivedFrom
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| foaf:homepage
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| foaf:isPrimaryTopicOf
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| foaf:name
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- IEEE Transactions on Advanced Packaging (en)
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| is dbo:wikiPageRedirects
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| is dbo:wikiPageWikiLink
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| is foaf:primaryTopic
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