An Entity of Type: periodical literature, from Named Graph: http://dbpedia.org, within Data Space: dbpedia.org

IEEE Transactions on Advanced Packaging was a quarterly peer-reviewed scientific journal published by the IEEE Components, Packaging & Manufacturing Technology Society and the IEEE Photonics Society. It covered research on the design, modeling, and applications of multi-chip modules and wafer-scale integration. It was established in 1999 and ceased publication in 2010. The last editor-in-chief was Ganesh Subbarayan (Purdue University). According to the Journal Citation Reports, the journal had a 2010 impact factor of 1.276.

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dbo:abbreviation
  • IEEE Trans. Adv. Packag.
dbo:abstract
  • IEEE Transactions on Advanced Packaging was a quarterly peer-reviewed scientific journal published by the IEEE Components, Packaging & Manufacturing Technology Society and the IEEE Photonics Society. It covered research on the design, modeling, and applications of multi-chip modules and wafer-scale integration. It was established in 1999 and ceased publication in 2010. The last editor-in-chief was Ganesh Subbarayan (Purdue University). According to the Journal Citation Reports, the journal had a 2010 impact factor of 1.276. (en)
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  • ITAPFZ
dbo:finalPublicationYear
  • 2010-01-01 (xsd:gYear)
dbo:firstPublicationYear
  • 1999-01-01 (xsd:gYear)
dbo:frequencyOfPublication
  • Quarterly
dbo:impactFactor
  • 1.276000 (xsd:double)
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  • 2010-01-01 (xsd:gYear)
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  • 1521-3323
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  • 99111625
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  • 39742480
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dbp:abbreviation
  • IEEE Trans. Adv. Packag. (en)
dbp:coden
  • ITAPFZ (en)
dbp:discipline
  • Multi-chip modules, wafer-scale integration (en)
dbp:editor
  • Ganesh Subbarayan (en)
dbp:formernames
  • IEEE Transactions on Components and Packaging Technologies, IEEE Transactions on Electronics Packaging Manufacturing (en)
dbp:frequency
  • Quarterly (en)
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  • 1999 (xsd:integer)
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  • 1.276000 (xsd:double)
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  • 2010 (xsd:integer)
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  • 1521 (xsd:integer)
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  • 99111625 (xsd:integer)
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  • 39742480 (xsd:integer)
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  • IEEE Transactions on Advanced Packaging (en)
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  • IEEE Transactions on Advanced Packaging was a quarterly peer-reviewed scientific journal published by the IEEE Components, Packaging & Manufacturing Technology Society and the IEEE Photonics Society. It covered research on the design, modeling, and applications of multi-chip modules and wafer-scale integration. It was established in 1999 and ceased publication in 2010. The last editor-in-chief was Ganesh Subbarayan (Purdue University). According to the Journal Citation Reports, the journal had a 2010 impact factor of 1.276. (en)
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  • IEEE Transactions on Advanced Packaging (en)
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  • IEEE Transactions on Advanced Packaging (en)
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