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- IEEE Transactions on Advanced Packaging was a quarterly peer-reviewed scientific journal published by the IEEE Components, Packaging & Manufacturing Technology Society and the IEEE Photonics Society. It covered research on the design, modeling, and applications of multi-chip modules and wafer-scale integration. It was established in 1999 and ceased publication in 2010. The last editor-in-chief was Ganesh Subbarayan (Purdue University). According to the Journal Citation Reports, the journal had a 2010 impact factor of 1.276. (en)
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- 2151 (xsd:nonNegativeInteger)
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dbp:abbreviation
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- IEEE Trans. Adv. Packag. (en)
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- Multi-chip modules, wafer-scale integration (en)
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- IEEE Transactions on Components and Packaging Technologies, IEEE Transactions on Electronics Packaging Manufacturing (en)
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- IEEE Transactions on Advanced Packaging (en)
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rdfs:comment
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- IEEE Transactions on Advanced Packaging was a quarterly peer-reviewed scientific journal published by the IEEE Components, Packaging & Manufacturing Technology Society and the IEEE Photonics Society. It covered research on the design, modeling, and applications of multi-chip modules and wafer-scale integration. It was established in 1999 and ceased publication in 2010. The last editor-in-chief was Ganesh Subbarayan (Purdue University). According to the Journal Citation Reports, the journal had a 2010 impact factor of 1.276. (en)
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- IEEE Transactions on Advanced Packaging (en)
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- IEEE Transactions on Advanced Packaging (en)
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