About: COM-HPC

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The computer-on-module for high performance compute (COM-HPC) form factor standard targets high I/O and computer performance levels. Each COM-HPC module integrates core CPU and memory functionality and input and output including USB up to Gen 4, audio (MIPI SoundWire, I2S and DMIC), graphics, (PCI Express) up to Gen. 5, and Ethernet up to 25 Gbits/s per lane. All I/O signals are mapped to two high density, high speed and low profile connectors on the bottom side of the module. COM-HPC employs a mezzanine-based approach. The COM modules plug into a carrier or base board that is typically customized to the application. Over time, the COM-HPC mezzanine modules can be upgraded to newer, backwards-compatible versions. COM-HPC targets Industrial, Military/Aerospace, Gaming, Medical, Transportati

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  • The computer-on-module for high performance compute (COM-HPC) form factor standard targets high I/O and computer performance levels. Each COM-HPC module integrates core CPU and memory functionality and input and output including USB up to Gen 4, audio (MIPI SoundWire, I2S and DMIC), graphics, (PCI Express) up to Gen. 5, and Ethernet up to 25 Gbits/s per lane. All I/O signals are mapped to two high density, high speed and low profile connectors on the bottom side of the module. COM-HPC employs a mezzanine-based approach. The COM modules plug into a carrier or base board that is typically customized to the application. Over time, the COM-HPC mezzanine modules can be upgraded to newer, backwards-compatible versions. COM-HPC targets Industrial, Military/Aerospace, Gaming, Medical, Transportation, IoT, and General Computing embedded applications and even scales up to RAM and performance hungry server or edge server applications. (en)
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  • The computer-on-module for high performance compute (COM-HPC) form factor standard targets high I/O and computer performance levels. Each COM-HPC module integrates core CPU and memory functionality and input and output including USB up to Gen 4, audio (MIPI SoundWire, I2S and DMIC), graphics, (PCI Express) up to Gen. 5, and Ethernet up to 25 Gbits/s per lane. All I/O signals are mapped to two high density, high speed and low profile connectors on the bottom side of the module. COM-HPC employs a mezzanine-based approach. The COM modules plug into a carrier or base board that is typically customized to the application. Over time, the COM-HPC mezzanine modules can be upgraded to newer, backwards-compatible versions. COM-HPC targets Industrial, Military/Aerospace, Gaming, Medical, Transportati (en)
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  • COM-HPC (en)
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