Electroless copper plating is a chemical process that deposits an even layer of copper on the surface of a solid substrate, like metal or plastic. The process involves dipping the substrate in a water solution containing copper salts and a reducing agent such as formaldehyde.
Attributes | Values |
---|---|
rdfs:label |
|
rdfs:comment |
|
foaf:depiction | |
dct:subject | |
Wikipage page ID |
|
Wikipage revision ID |
|
Link from a Wikipage to another Wikipage |
|
sameAs | |
dbp:wikiPageUsesTemplate | |
thumbnail | |
has abstract |
|
prov:wasDerivedFrom | |
page length (characters) of wiki page |
|
foaf:isPrimaryTopicOf | |
is Link from a Wikipage to another Wikipage of | |
is foaf:primaryTopic of |