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The strength of metal oxide adhesion effectively determines the wetting of the metal-oxide interface. The strength of this adhesion is important, for instance, in production of light bulbs and fiber-matrix composites that depend on the optimization of wetting to create metal-ceramic interfaces. The strength of adhesion also determines the extent of dispersion on catalytically active metal.Metal oxide adhesion is important for applications such as complementary metal oxide semiconductor devices. These devices make possible the high packing densities of modern integrated circuits.

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  • The strength of metal oxide adhesion effectively determines the wetting of the metal-oxide interface. The strength of this adhesion is important, for instance, in production of light bulbs and fiber-matrix composites that depend on the optimization of wetting to create metal-ceramic interfaces. The strength of adhesion also determines the extent of dispersion on catalytically active metal.Metal oxide adhesion is important for applications such as complementary metal oxide semiconductor devices. These devices make possible the high packing densities of modern integrated circuits. (en)
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dbo:wikiPageID
  • 32006122 (xsd:integer)
dbo:wikiPageLength
  • 20440 (xsd:nonNegativeInteger)
dbo:wikiPageRevisionID
  • 1117398743 (xsd:integer)
dbo:wikiPageWikiLink
dbp:wikiPageUsesTemplate
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rdf:type
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  • The strength of metal oxide adhesion effectively determines the wetting of the metal-oxide interface. The strength of this adhesion is important, for instance, in production of light bulbs and fiber-matrix composites that depend on the optimization of wetting to create metal-ceramic interfaces. The strength of adhesion also determines the extent of dispersion on catalytically active metal.Metal oxide adhesion is important for applications such as complementary metal oxide semiconductor devices. These devices make possible the high packing densities of modern integrated circuits. (en)
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  • Metal oxide adhesion (en)
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