In printed circuit boards, teardrops are typically drop-shaped features at the junction of vias (teardrop vias) or contact pads (teardrop pads) and traces (teardrop traces). The main purpose of teardrops is to enhance structural integrity in presence of thermal or mechanical stresses, for example due to vibration or flexing. Structural integrity may be compromised, e.g., by misalignment during drilling, so that too much copper may be removed by the drill hole in the area where a trace connects to the pad or via. An extra advantage is the enlarging of manufacturing tolerances, making manufacturing easier and cheaper.
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