About: Disco Corporation

An Entity of Type: Public company, from Named Graph: http://dbpedia.org, within Data Space: dbpedia.org

DISCO Corporation (株式会社ディスコ, Kabushiki-gaisha Disuko) is a Japanese precision tools maker, especially for the semiconductor production industry. The company makes dicing saws and laser saws to cut semiconductor silicon wafers and other materials; grinders to process silicon and compound semiconductor wafers to ultra-thin levels; polishing machines to remove the grinding damage layer from the wafer back-side and to increase chip strength.

Property	Value
dbo:abstract	DISCO Corporation (株式会社ディスコ, Kabushiki-gaisha Disuko) is a Japanese precision tools maker, especially for the semiconductor production industry. The company makes dicing saws and laser saws to cut semiconductor silicon wafers and other materials; grinders to process silicon and compound semiconductor wafers to ultra-thin levels; polishing machines to remove the grinding damage layer from the wafer back-side and to increase chip strength. (en) 株式会社ディスコ（英: DISCO CORPORATION）は、シリコンウェハー加工機器メーカーである。広島県の呉市で創業した。 (ja)
dbo:foundingDate	1937-05-05 (xsd:date)
dbo:foundingYear	1937-01-01 (xsd:gYear)
dbo:industry	dbr:Semiconductor
dbo:keyPerson	dbr:CEO dbr:President_(corporate_title) dbr:Chairman
dbo:locationCity	dbr:Ōmori,_Ōta,_Tokyo dbr:Ōta,_Tokyo
dbo:numberOfEmployees	4091 (xsd:nonNegativeInteger)
dbo:originalName	株式会社ディスコ (en)
dbo:product	dbr:Dicing_saw dbr:Die_preparation dbr:Grinding_machine dbr:Chemical-mechanical_planarization
dbo:revenue	2.21E9 2.5378E11
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dbp:areaServed	Worldwide (en)
dbp:foundation	1937-05-05 (xsd:date)
dbp:founder	Mitsuo Sekiya (en)
dbp:homepage	https://www.disco.co.jp/eg/index.html
dbp:hqLocationCity	Omori-Kita, Ōta, Tokyo 162-8557 (en)
dbp:hqLocationCountry	Japan (en)
dbp:industry	dbr:Semiconductor
dbp:isin	JP3548600000 (en)
dbp:keyPeople	Hitoshi Mizorogi (en) Kazuma Sekiya (en)
dbp:logo	Disco Corporation company logo.svg (en)
dbp:logoSize	240 (xsd:integer)
dbp:name	DISCO Corporation (en)
dbp:nativeName	株式会社ディスコ (en)
dbp:netIncome	(en) JPY ¥66.21 billion (en)
dbp:numEmployees	4091 (xsd:integer)
dbp:products	dbr:Die_preparation dbr:Chemical-mechanical_planarization (en) Dicing saws (en) Grinders (en) Laser saws (en)
dbp:revenue	JPY ¥253.78 billion (en)
dbp:type	dbr:Kabushiki_Kaisha dbr:Public_company
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rdfs:comment	DISCO Corporation (株式会社ディスコ, Kabushiki-gaisha Disuko) is a Japanese precision tools maker, especially for the semiconductor production industry. The company makes dicing saws and laser saws to cut semiconductor silicon wafers and other materials; grinders to process silicon and compound semiconductor wafers to ultra-thin levels; polishing machines to remove the grinding damage layer from the wafer back-side and to increase chip strength. (en) 株式会社ディスコ（英: DISCO CORPORATION）は、シリコンウェハー加工機器メーカーである。広島県の呉市で創業した。 (ja)
rdfs:label	Disco Corporation (en) ディスコ (切断装置製造) (ja)
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