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Statements

Subject Item
dbr:Flatpack_(electronics)
rdf:type
yago:WikicatChipCarriers yago:CausalAgent100007347 yago:Person100007846 yago:PhysicalEntity100001930 yago:Traveler109629752 yago:Whole100003553 yago:Carrier109897696 yago:LivingThing100004258 yago:YagoLegalActor yago:YagoLegalActorGeo yago:Organism100004475 dbo:Software yago:Object100002684
rdfs:label
Flatpack (electronics) Flat-pack
rdfs:comment
Flatpack es un tipo de encapsulado para montaje en superficie en circuitos impresos estandarizado por las USAF. El estándar militar MIL-STD-1835C define: Flat package (FP). Un encapsulado cuadrado o rectangular con patillas paralelas al plano de la base adheridas a los dos lados opuestos del perímetro del encapsulado. La norma indica además distintas variantes con diversos parámetros que incluyen, entre otros, el material del cuerpo del encapsulado, la posición de los terminales, el perfil del encapsulado, la forma de los pines o el orden de cada terminal. Flatpack is a US military standardized printed-circuit-board surface-mount-component package. The military standard MIL-STD-1835C defines: Flat package (FP). A rectangular or square package with leads parallel to base plane attached on two opposing sides of the package periphery. The standard further defines different types with varying parameters which includes package body material, terminal location, package outline, lead form and terminal count.
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dbc:Chip_carriers
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dbo:abstract
Flatpack es un tipo de encapsulado para montaje en superficie en circuitos impresos estandarizado por las USAF. El estándar militar MIL-STD-1835C define: Flat package (FP). Un encapsulado cuadrado o rectangular con patillas paralelas al plano de la base adheridas a los dos lados opuestos del perímetro del encapsulado. La norma indica además distintas variantes con diversos parámetros que incluyen, entre otros, el material del cuerpo del encapsulado, la posición de los terminales, el perfil del encapsulado, la forma de los pines o el orden de cada terminal. Flatpack is a US military standardized printed-circuit-board surface-mount-component package. The military standard MIL-STD-1835C defines: Flat package (FP). A rectangular or square package with leads parallel to base plane attached on two opposing sides of the package periphery. The standard further defines different types with varying parameters which includes package body material, terminal location, package outline, lead form and terminal count. The main vehicle for testing of high reliability flatpack packages has been MIL-PRF-38534 (General Specification for Hybrid Microcircuits). This document outlines the general requirements of fully assembled devices, whether they are single chip, multichip, or of hybrid technology. The test procedures of these requirements are found in MIL-STD-883 (Test Methods and Procedures for Microelectronics) as a listing of test methods. These methods cover various aspects of the minimum requirements that a microelectronics device must be able to attain before it is considered a compliant device.
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