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- transistor circuit technology used in IBM System/360 (en)
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- Steps in manufacturing Solid Logic Technology hybrid modules. The process starts with a blank ceramic wafer, square. Circuits are laid down first, followed by resistive material. Pins are added, the circuits are soldered and the resistors trimmed to the desired value. Then individual transistors and diodes are added and the package is encapsulated. (en)
- Many SLT cards plugged into a board (en)
- SLT cards in an IBM 129 keypunch (en)
- Three single-width SLT cards (en)
- A double-width SLT card. The square metal cans contain the hybrid circuits. (en)
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- SLT cards in situ (en)
- Solid Logic Technology cards (en)
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- IBM 129 SLT modules.jpg (en)
- IBM SLT cards, three.agr.jpg (en)
- SLT Card Frame.corestore.jpg (en)
- Slt1.jpg (en)
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- Solid Logic Technology (en)
- IBMソリッド・ロジック・テクノロジ (ja)
- IBM Solid Logic Technology (ru)
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