Thin small outline package (TSOP) is a type of surface mount IC package. They are very low-profile (about 1mm) and have tight lead spacing (as low as 0.5mm). They are frequently used for RAM or Flash memory ICs due to their high pin count and small volume. In some applications, they are being supplanted by ball grid array packages which can achieve even higher densities. The prime application for this technology is memory. SRAM, flash memory, and E2PROM manufacturers find this package well suited to their end-use products. It answers the needs required by telecom, cellular, memory modules, PC cards (PCMCIA cards), wireless, netbooks and countless other product applications.
| Attributes | Values |
|---|
| rdfs:label
| - Thin Small Outline Package (de)
- Thin small outline package (nl)
- Thin small outline package (en)
- Thin Small-Outline Package (pt)
- TSOP (ru)
|
| rdfs:comment
| - Thin small-outline package (engl., TSOP) ist ein Chipgehäusetyp für die Oberflächenmontage (SMD) von integrierten Schaltkreisen (ICs). Ein besonderes Merkmal dieser Gehäuseform ist die geringe Höhe (etwa 1 mm) und der bei manchen Typen geringe Pinabstand von 0,5 mm. (de)
- Thin small outline package (TSOP) is een type surface mount IC-behuizing. (nl)
- TSOP (англ. Thin Small-Outline Package — тонкий малогабаритный корпус) — разновидность корпуса поверхностно-монтируемых микросхем. Отличается небольшой толщиной (около 1 мм) и небольшим интервалом между выводами микросхемы. Применяются в модулях оперативной памяти DRAM и для чипов флеш-памяти, особенно для упаковки низковольтных микросхем из-за их малого объёма и большого количества контактов. В современных устройствах, требующих ещё большей плотности расположения компонентов, вытеснены более компактными корпусами типа BGA. (ru)
- Thin Small-Outline Packages ou TSOPs são um tipo de encapsulamento de circuitos integrados usado em montagem superficial. Eles são incrivelmente finos e possuem um espaçamento entre os terminais de até 0,5 mm. São usados frequentemente em CIs de memória flash ou RAM, devido a sua grande quantidade de terminais e pequeno volume. Todavia, estão sendo suplantados pelos encapsulamentos , os quais podem concentrar densidades ainda mais altas. (pt)
- Thin small outline package (TSOP) is a type of surface mount IC package. They are very low-profile (about 1mm) and have tight lead spacing (as low as 0.5mm). They are frequently used for RAM or Flash memory ICs due to their high pin count and small volume. In some applications, they are being supplanted by ball grid array packages which can achieve even higher densities. The prime application for this technology is memory. SRAM, flash memory, and E2PROM manufacturers find this package well suited to their end-use products. It answers the needs required by telecom, cellular, memory modules, PC cards (PCMCIA cards), wireless, netbooks and countless other product applications. (en)
|
| foaf:depiction
| |
| dcterms:subject
| |
| Wikipage page ID
| |
| Wikipage revision ID
| |
| Link from a Wikipage to another Wikipage
| |
| Link from a Wikipage to an external page
| |
| sameAs
| |
| dbp:wikiPageUsesTemplate
| |
| thumbnail
| |
| has abstract
| - Thin small-outline package (engl., TSOP) ist ein Chipgehäusetyp für die Oberflächenmontage (SMD) von integrierten Schaltkreisen (ICs). Ein besonderes Merkmal dieser Gehäuseform ist die geringe Höhe (etwa 1 mm) und der bei manchen Typen geringe Pinabstand von 0,5 mm. (de)
- Thin small outline package (TSOP) is a type of surface mount IC package. They are very low-profile (about 1mm) and have tight lead spacing (as low as 0.5mm). They are frequently used for RAM or Flash memory ICs due to their high pin count and small volume. In some applications, they are being supplanted by ball grid array packages which can achieve even higher densities. The prime application for this technology is memory. SRAM, flash memory, and E2PROM manufacturers find this package well suited to their end-use products. It answers the needs required by telecom, cellular, memory modules, PC cards (PCMCIA cards), wireless, netbooks and countless other product applications. TSOP is the smallest leaded form factor for flash memory. (en)
- Thin small outline package (TSOP) is een type surface mount IC-behuizing. (nl)
- TSOP (англ. Thin Small-Outline Package — тонкий малогабаритный корпус) — разновидность корпуса поверхностно-монтируемых микросхем. Отличается небольшой толщиной (около 1 мм) и небольшим интервалом между выводами микросхемы. Применяются в модулях оперативной памяти DRAM и для чипов флеш-памяти, особенно для упаковки низковольтных микросхем из-за их малого объёма и большого количества контактов. В современных устройствах, требующих ещё большей плотности расположения компонентов, вытеснены более компактными корпусами типа BGA. (ru)
- Thin Small-Outline Packages ou TSOPs são um tipo de encapsulamento de circuitos integrados usado em montagem superficial. Eles são incrivelmente finos e possuem um espaçamento entre os terminais de até 0,5 mm. São usados frequentemente em CIs de memória flash ou RAM, devido a sua grande quantidade de terminais e pequeno volume. Todavia, estão sendo suplantados pelos encapsulamentos , os quais podem concentrar densidades ainda mais altas. (pt)
|
| prov:wasDerivedFrom
| |
| page length (characters) of wiki page
| |
| foaf:isPrimaryTopicOf
| |
| is Link from a Wikipage to another Wikipage
of | |
| is Wikipage redirect
of | |
| is foaf:primaryTopic
of | |
_BW.svg)
![[RDF Data]](/fct/images/sw-rdf-blue.png)
![[cxml]](/fct/images/cxml_doc.png)
![[csv]](/fct/images/csv_doc.png)
![[text]](/fct/images/ntriples_doc.png)
![[turtle]](/fct/images/n3turtle_doc.png)
![[ld+json]](/fct/images/jsonld_doc.png)
![[rdf+json]](/fct/images/json_doc.png)
![[rdf+xml]](/fct/images/xml_doc.png)
![[atom+xml]](/fct/images/atom_doc.png)
![[html]](/fct/images/html_doc.png)
