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About: Lead frame     Goto   Sponge   NotDistinct   Permalink

An Entity of Type : yago:Whole100003553, within Data Space : dbpedia.org associated with source document(s)

Type: yago:WikicatChipCarriersyago:Carrier109897696yago:CausalAgent100007347yago:LivingThing100004258yago:Object100002684yago:Organism100004475yago:Person100007846yago:PhysicalEntity100001930yago:YagoLegalActoryago:YagoLegalActorGeobuildingyago:Traveler109629752yago:Whole100003553 New Facet based on Instances of this Class

A lead frame (pronounced /lid/ LEED) is the metal structure inside a chip package that carries signals from the die to the outside. The lead frame consists of a central die pad, where the die is placed, surrounded by leads, metal conductors leading away from the die to the outside world. The end of each lead closest to the die ends in a bond pad. Small bond wires connect the die to each bond pad. Mechanical connections fix all these parts into a rigid structure, which makes the whole lead frame easy to handle automatically.