About: Hardmask

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A hardmask is a material used in semiconductor processing as an etch mask instead of a polymer or other organic "soft" resist material. Hardmasks are necessary when the material being etched is itself an organic polymer. Anything used to etch this material will also etch the photoresist being used to define its patterning since that is also an organic polymer. This arises, for instance, in the patterning of low-κ dielectric insulation layers used in VLSI fabrication. Polymers tend to be etched easily by oxygen, fluorine, chlorine and other reactive gases used in plasma etching.

Attributes	Values
rdf:type	chemical compound
rdfs:label	Hardmask (en) ハードマスク (ja)
rdfs:comment	ハードマスクとは、半導体プロセスでエッチマスクとしてポリマーやその他のソフトな有機レジスト材料の代わりに用いられる材料のこと。ポリマーは酸素、フッ素、塩素などの反応性ガスによって容易にエッチングされる。ポリマーマスクを用いて作られるパターンはの間で急速に劣化する。 (ja) A hardmask is a material used in semiconductor processing as an etch mask instead of a polymer or other organic "soft" resist material. Hardmasks are necessary when the material being etched is itself an organic polymer. Anything used to etch this material will also etch the photoresist being used to define its patterning since that is also an organic polymer. This arises, for instance, in the patterning of low-κ dielectric insulation layers used in VLSI fabrication. Polymers tend to be etched easily by oxygen, fluorine, chlorine and other reactive gases used in plasma etching. (en)
dcterms:subject	Semiconductor device fabrication
Wikipage page ID	10872064 (xsd:integer)
Wikipage revision ID	1098536422 (xsd:integer)
Link from a Wikipage to another Wikipage	Amorphous carbon VLSI Low-κ dielectric Silicon carbide Silicon dioxide Titanium nitride Plasma etching Fluorine Oxygen Photoresist Resist Tantalum nitride Semiconductor device fabrication Chlorine Organic polymer Semiconductor Etching (microfabrication) dbr:Carbon_doped_hydrogenated_silicon_oxide
sameAs	Hardmask Hardmask Hardmask Hardmask
dbp:wikiPageUsesTemplate	dbt:ISBN dbt:Reflist dbt:Short_description dbt:Materials-sci-stub
has abstract	A hardmask is a material used in semiconductor processing as an etch mask instead of a polymer or other organic "soft" resist material. Hardmasks are necessary when the material being etched is itself an organic polymer. Anything used to etch this material will also etch the photoresist being used to define its patterning since that is also an organic polymer. This arises, for instance, in the patterning of low-κ dielectric insulation layers used in VLSI fabrication. Polymers tend to be etched easily by oxygen, fluorine, chlorine and other reactive gases used in plasma etching. Use of a hardmask involves an additional deposition process, and hence additional cost. First, the hardmask material is deposited and etched into the required pattern using a standard photoresist process. Following that the underlying material can be etched through the hardmask. Finally the hardmask is removed with a further etching process. Hardmask materials can be metal or dielectric. Silicon based masks such as silicon dioxide or silicon carbide are usually used for etching low-κ dielectrics. However, SiOCH, a material used to insulate copper interconnects, requires an etchant that attacks silicon compounds. For this material, metal or amorphous carbon hardmasks are used. The most common metal for hardmasks is titanium nitride, but tantalum nitride has also been used. (en) ハードマスクとは、半導体プロセスでエッチマスクとしてポリマーやその他のソフトな有機レジスト材料の代わりに用いられる材料のこと。ポリマーは酸素、フッ素、塩素などの反応性ガスによって容易にエッチングされる。ポリマーマスクを用いて作られるパターンはの間で急速に劣化する。 (ja)
gold:hypernym	Material
prov:wasDerivedFrom	wikipedia-en:Hardmask?oldid=1098536422&ns=0
page length (characters) of wiki page	2655 (xsd:nonNegativeInteger)
foaf:isPrimaryTopicOf	wikipedia-en:Hardmask
is Link from a Wikipage to another Wikipage of	14 nm process Multiple patterning Photoresist Lam Research Hard mask
is Wikipage redirect of	Hard mask
is foaf:primaryTopic of	wikipedia-en:Hardmask

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