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About: Die preparation     Goto   Sponge   NotDistinct   Permalink

An Entity of Type : dbo:MilitaryConflict, within Data Space : dbpedia.org associated with source document(s)

Type: military conflict New Facet based on Instances of this Class

Die preparation is a step of semiconductor device fabrication during which a wafer is prepared for IC packaging and . The process of die preparation typically consists of two steps: wafer mounting and wafer dicing.