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About: Decapping     Goto   Sponge   NotDistinct   Permalink

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Decapping (decapsulation) or delidding of an integrated circuit is the process of removing the protective cover or integrated heat spreader (IHS) of an integrated circuit so that the contained die is revealed for visual inspection of the micro circuitry imprinted on the die. This process is typically done in order to debug a manufacturing problem with the chip, or possibly to copy information from the device, to check for counterfeit chips or to reverse engineer it. Companies such as TechInsights and ChipRebel decap, take die shots of, and reverse engineer chips for customers. Modern integrated circuits can be encapsulated in plastic, ceramic, or epoxy packages.