About: Carbon nanotubes in interconnects

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In nanotechnology, carbon nanotube interconnects refer to the proposed use of carbon nanotubes in the interconnects between the elements of an integrated circuit. Carbon nanotubes (CNTs) can be thought of as single atomic layer graphite sheets rolled up to form seamless cylinders. Depending on the direction on which they are rolled, CNTs can be semiconducting or metallic. Metallic carbon nanotubes have been identified as a possible interconnect material for the future technology generations and to replace copper interconnects. Electron transport can go over long nanotube lengths, 1 μm, enabling CNTs to carry very high currents (i.e. up to a current density of 109 A∙cm−2) with essentially no heating due to nearly one dimensional electronic structure. Despite the current saturation in CNTs a

Attributes	Values
rdfs:label	Carbon nanotubes in interconnects (en)
rdfs:comment	In nanotechnology, carbon nanotube interconnects refer to the proposed use of carbon nanotubes in the interconnects between the elements of an integrated circuit. Carbon nanotubes (CNTs) can be thought of as single atomic layer graphite sheets rolled up to form seamless cylinders. Depending on the direction on which they are rolled, CNTs can be semiconducting or metallic. Metallic carbon nanotubes have been identified as a possible interconnect material for the future technology generations and to replace copper interconnects. Electron transport can go over long nanotube lengths, 1 μm, enabling CNTs to carry very high currents (i.e. up to a current density of 109 A∙cm−2) with essentially no heating due to nearly one dimensional electronic structure. Despite the current saturation in CNTs a (en)
dcterms:subject	Carbon nanotubes Integrated circuits Nanotechnology
Wikipage page ID	51056408 (xsd:integer)
Wikipage revision ID	1121800635 (xsd:integer)
Link from a Wikipage to another Wikipage	Ampacity Ampere Electromigration Electron energy loss spectroscopy Nanowire Anode VLSI Integrated circuit International Technology Roadmap for Semiconductors Nanotechnology Chemical vapor deposition Scanning thermal microscopy Copper Centimetre Titanium nitride Laser ablation Current density Carbon nanotubes Carbon nanotube Grain boundary Thermal conductivity Logic gate Integrated circuits Nanotechnology Transistor Transmission electron microscopy CMOS Phonon Interconnects (integrated circuits) Micrometre NanoHUB RLC circuit Semiconductor Nanoelectronics Vertically aligned carbon nanotube arrays Raman spectroscopy
sameAs	Carbon nanotubes in interconnects Carbon nanotubes in interconnects
dbp:wikiPageUsesTemplate	dbt:Multiple_issues dbt:Notability dbt:Reflist dbt:Technical
has abstract	In nanotechnology, carbon nanotube interconnects refer to the proposed use of carbon nanotubes in the interconnects between the elements of an integrated circuit. Carbon nanotubes (CNTs) can be thought of as single atomic layer graphite sheets rolled up to form seamless cylinders. Depending on the direction on which they are rolled, CNTs can be semiconducting or metallic. Metallic carbon nanotubes have been identified as a possible interconnect material for the future technology generations and to replace copper interconnects. Electron transport can go over long nanotube lengths, 1 μm, enabling CNTs to carry very high currents (i.e. up to a current density of 109 A∙cm−2) with essentially no heating due to nearly one dimensional electronic structure. Despite the current saturation in CNTs at high fields, the mitigation of such effects is possible due to encapsulated nanowires. Carbon nanotubes for interconnects application in Integrated chips have been studied since 2001, however the extremely attractive performances of individual tubes are difficult to reach when they are assembled in large bundles necessary to make real via or lines in integrated chips. Two proposed approaches to overcome the to date limitations are either to make very tiny local connections that will be needed in future advanced chips or to make carbon metal composite structure that will be compatible with existing microelectronic processes. Hybrid interconnects that employ CNT vias in tandem with copper interconnects may offer advantages in reliability and thermal-management. In 2016, the European Union has funded a four million euro project over three years to evaluate manufacturability and performance of composite interconnects employing both CNT and copper interconnects. The project named CONNECT (CarbON Nanotube compositE InterconneCTs) involves the joint efforts of seven European research and industry partners on fabrication techniques and processes to enable reliable carbon nanotubes for on-chip interconnects in ULSI microchip production. (en)
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foaf:isPrimaryTopicOf	wikipedia-en:Carbon_nanotubes_in_interconnects
is Link from a Wikipage to another Wikipage of	Interconnect (integrated circuits) Copper interconnects Carbon nanotube Nanoelectromechanical systems
is foaf:primaryTopic of	wikipedia-en:Carbon_nanotubes_in_interconnects

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