About: Flatpack (electronics)

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Flatpack is a US military standardized printed-circuit-board surface-mount-component package. The military standard MIL-STD-1835C defines: Flat package (FP). A rectangular or square package with leads parallel to base plane attached on two opposing sides of the package periphery. The standard further defines different types with varying parameters which includes package body material, terminal location, package outline, lead form and terminal count.

Attributes	Values
rdf:type	software yago:WikicatChipCarriers yago:Carrier109897696 yago:CausalAgent100007347 yago:LivingThing100004258 yago:Object100002684 yago:Organism100004475 yago:Person100007846 yago:PhysicalEntity100001930 yago:YagoLegalActor yago:YagoLegalActorGeo yago:Traveler109629752 yago:Whole100003553
rdfs:label	Flat-pack (es) Flatpack (electronics) (en)
rdfs:comment	Flatpack es un tipo de encapsulado para montaje en superficie en circuitos impresos estandarizado por las USAF. El estándar militar MIL-STD-1835C define: Flat package (FP). Un encapsulado cuadrado o rectangular con patillas paralelas al plano de la base adheridas a los dos lados opuestos del perímetro del encapsulado. La norma indica además distintas variantes con diversos parámetros que incluyen, entre otros, el material del cuerpo del encapsulado, la posición de los terminales, el perfil del encapsulado, la forma de los pines o el orden de cada terminal. (es) Flatpack is a US military standardized printed-circuit-board surface-mount-component package. The military standard MIL-STD-1835C defines: Flat package (FP). A rectangular or square package with leads parallel to base plane attached on two opposing sides of the package periphery. The standard further defines different types with varying parameters which includes package body material, terminal location, package outline, lead form and terminal count. (en)
foaf:depiction
dcterms:subject	Chip carriers
Wikipage page ID	20514106 (xsd:integer)
Wikipage revision ID	1048833593 (xsd:integer)
Link from a Wikipage to another Wikipage	Quad Flat Package MIL-PRF-38534 MIL-STD-883 Integrated circuit packaging TO-5 Dual in-line package Lead (electronics) Chip carriers Texas Instruments Terminal (electronics) Printed circuit board Surface-mount technology
sameAs	Flatpack (electronics) Flatpack (electronics) Flatpack (electronics) Flatpack (electronics) Flatpack (electronics)
dbp:wikiPageUsesTemplate	dbt:Semiconductor_packages dbt:Nbsp dbt:Reflist dbt:Short_description dbt:Electronics-stub
thumbnail	wiki-commons:Special:FilePath/KL_TI_SN5451_Logic_IC.jpg?width=300
has abstract	Flatpack is a US military standardized printed-circuit-board surface-mount-component package. The military standard MIL-STD-1835C defines: Flat package (FP). A rectangular or square package with leads parallel to base plane attached on two opposing sides of the package periphery. The standard further defines different types with varying parameters which includes package body material, terminal location, package outline, lead form and terminal count. The main vehicle for testing of high reliability flatpack packages has been MIL-PRF-38534 (General Specification for Hybrid Microcircuits). This document outlines the general requirements of fully assembled devices, whether they are single chip, multichip, or of hybrid technology. The test procedures of these requirements are found in MIL-STD-883 (Test Methods and Procedures for Microelectronics) as a listing of test methods. These methods cover various aspects of the minimum requirements that a microelectronics device must be able to attain before it is considered a compliant device. (en) Flatpack es un tipo de encapsulado para montaje en superficie en circuitos impresos estandarizado por las USAF. El estándar militar MIL-STD-1835C define: Flat package (FP). Un encapsulado cuadrado o rectangular con patillas paralelas al plano de la base adheridas a los dos lados opuestos del perímetro del encapsulado. La norma indica además distintas variantes con diversos parámetros que incluyen, entre otros, el material del cuerpo del encapsulado, la posición de los terminales, el perfil del encapsulado, la forma de los pines o el orden de cada terminal. (es)
gold:hypernym	Package
prov:wasDerivedFrom	wikipedia-en:Flatpack_(electronics)?oldid=1048833593&ns=0
page length (characters) of wiki page	2769 (xsd:nonNegativeInteger)
foaf:isPrimaryTopicOf	wikipedia-en:Flatpack_(electronics)
is Link from a Wikipage to another Wikipage of	Integrated circuit Integrated circuit packaging List of integrated circuit packaging types Semiconductor package Apollo Guidance Computer Dual in-line package 7400-series integrated circuits Explorer 18 Kombinat Mikroelektronik Erfurt CP-823/U Soviet integrated circuit designation Transistor–transistor logic
is foaf:primaryTopic of	wikipedia-en:Flatpack_(electronics)

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