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Statements

Subject Item
dbr:Pad_cratering
rdf:type
yago:State100024720 yago:Imperfection114462666 yago:Attribute100024264 yago:Abstraction100002137 yago:WikicatSolderingDefects yago:Defect114464005
rdfs:label
Pad cratering
rdfs:comment
Pad cratering is a mechanically induced fracture in the resin between copper foil and outermost layer of fiberglass of a printed circuit board (PCB). It may be within the resin or at the resin to fiberglass interface. The pad remains connected to the component (usually a Ball Grid Array, BGA) and leaves a "crater" on the surface of the printed circuit board.
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dbr:Physics_of_failure dbr:Solder_ball dbc:Printed_circuit_board_manufacturing dbr:Temperature_cycling dbr:Scanning_electron_microscope dbr:Yield_(engineering) dbr:Ball_Grid_Array dbr:In-circuit_test dbr:Nondestructive_testing dbr:Alloy dbr:Thermal_expansion dbr:Shock_(mechanics) dbr:X-ray_microscope dbr:Creep_(deformation) dbr:Finite_Element_Analysis dbr:Printed_circuit_board dbr:Depaneling dbr:Destructive_testing dbr:Fracture dbr:Young’s_modulus dbr:Fiberglass dbr:Solder dbr:Failure_analysis dbr:Plasticity_(physics) dbr:Thermal_shock dbc:Soldering_defects
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dbo:abstract
Pad cratering is a mechanically induced fracture in the resin between copper foil and outermost layer of fiberglass of a printed circuit board (PCB). It may be within the resin or at the resin to fiberglass interface. The pad remains connected to the component (usually a Ball Grid Array, BGA) and leaves a "crater" on the surface of the printed circuit board.
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wikipedia-en:Pad_cratering