Park Electrochemical Corp, now called the Park Aerospace Corp, is a Melville, New York-based materials manufacturer for the telecommunications, Internet infrastructure, high-end computing, and aerospace industries. It produces high-technology digital and radio frequency(RF)/microwave printed circuit material products, composite materials. Its printed circuit materials are used for complex multilayer printed circuit boards and other electronic interconnection systems, such as multilayer back-planes, wireless packages, high-speed/low-loss multilayers, and high density interconnects (HDIs). Its core capabilities are polymer chemistry formulation and coating technology.
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