No-clean processing refers to the printed circuit board assembly process that lets flux residues remain after reflow. Reference: S. Zhan, M. H. Azarian and M. Pecht, Surface Insulation Resistance of Conformally Coated Printed Circuit Boards Processed with No-Clean Flux, IEEE Transactions on Electronics Packaging Manufacturing, vol.29, no.3, p 217-223, July, 2006.

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dbpprop:abstract
  • No-clean processing refers to the printed circuit board assembly process that lets flux residues remain after reflow. Reference: S. Zhan, M. H. Azarian and M. Pecht, Surface Insulation Resistance of Conformally Coated Printed Circuit Boards Processed with No-Clean Flux, IEEE Transactions on Electronics Packaging Manufacturing, vol.29, no.3, p 217-223, July, 2006.
dbpprop:doiInlineProperty
  • 10.1109/TEPM.2006.882496
  • Surface Insulation Resistance of Conformally Coated Printed Circuit Boards Processed with No-Clean Flux
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  • No-clean processing refers to the printed circuit board assembly process that lets flux residues remain after reflow. Reference: S. Zhan, M. H. Azarian and M. Pecht, Surface Insulation Resistance of Conformally Coated Printed Circuit Boards Processed with No-Clean Flux, IEEE Transactions on Electronics Packaging Manufacturing, vol.29, no.3, p 217-223, July, 2006.
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  • No clean processing
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