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Pad cratering is a mechanically induced fracture in the resin between copper foil and outermost layer of fiberglass of a printed circuit board (PCB). It may be within the resin or at the resin to fiberglass interface. The pad remains connected to the component (usually a Ball Grid Array, BGA) and leaves a "crater" on the surface of the printed circuit board. * BGA pad and solder ball exhibiting pad cratering. * Magnified view of cross section of BGA pad and solder ball. Dielectric has cracked and the pad has started to lift, eventually creating pad cratering. *

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  • Pad cratering
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  • Pad cratering is a mechanically induced fracture in the resin between copper foil and outermost layer of fiberglass of a printed circuit board (PCB). It may be within the resin or at the resin to fiberglass interface. The pad remains connected to the component (usually a Ball Grid Array, BGA) and leaves a "crater" on the surface of the printed circuit board. * BGA pad and solder ball exhibiting pad cratering. * Magnified view of cross section of BGA pad and solder ball. Dielectric has cracked and the pad has started to lift, eventually creating pad cratering. *
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  • Pad cratering is a mechanically induced fracture in the resin between copper foil and outermost layer of fiberglass of a printed circuit board (PCB). It may be within the resin or at the resin to fiberglass interface. The pad remains connected to the component (usually a Ball Grid Array, BGA) and leaves a "crater" on the surface of the printed circuit board. IPC T-50, Revision H, Terms and Definitions for Interconnecting and Packaging Electronic Circuits, 96.2176 - Pad Cratering. A separation of the pad from the printed board resin/weave composite or within the composite immediately adjacent to the pad as a result of mechanical and/or thermal stress. * BGA pad and solder ball exhibiting pad cratering. * Magnified view of cross section of BGA pad and solder ball. Dielectric has cracked and the pad has started to lift, eventually creating pad cratering. * Pad crater left on printed circuit board after copper pad from a BGA connection has been pulled away.
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