About: Copper pour     Goto   Sponge   NotDistinct   Permalink

An Entity of Type : owl:Thing, within Data Space : dbpedia.org associated with source document(s)
QRcode icon
http://dbpedia.org/describe/?url=http%3A%2F%2Fdbpedia.org%2Fresource%2FCopper_pour

In electronics, the term "copper pour" refers to an area on a printed circuit board filled with copper (the metal used to make connections in printed circuit boards). Copper pour is commonly used to create a ground plane. Another reason for using copper pour is to reduce the amount of etching fluid used during manufacturing. PCB designers today almost invariably use completely solid areas of copper pour that completely cover the remaining area outside those tracks, pads, and stand-off regions.Many early PCBs have a "hatched copper pour", sometimes called a "cherry pie lattice".

AttributesValues
rdfs:label
  • Copper pour
rdfs:comment
  • In electronics, the term "copper pour" refers to an area on a printed circuit board filled with copper (the metal used to make connections in printed circuit boards). Copper pour is commonly used to create a ground plane. Another reason for using copper pour is to reduce the amount of etching fluid used during manufacturing. PCB designers today almost invariably use completely solid areas of copper pour that completely cover the remaining area outside those tracks, pads, and stand-off regions.Many early PCBs have a "hatched copper pour", sometimes called a "cherry pie lattice".
sameAs
dct:subject
Wikipage page ID
Wikipage revision ID
Link from a Wikipage to another Wikipage
foaf:depiction
  • External Image
foaf:isPrimaryTopicOf
thumbnail
prov:wasDerivedFrom
has abstract
  • In electronics, the term "copper pour" refers to an area on a printed circuit board filled with copper (the metal used to make connections in printed circuit boards). Copper pour is commonly used to create a ground plane. Another reason for using copper pour is to reduce the amount of etching fluid used during manufacturing. A distinctive feature of copper pour is the backoff (or stand-off) - a certain distance between the copper pour and any tracks or pads not belonging to the same electrical net. A copper pour therefore looks like it flows around other components, with the exception of pads which are connected to the copper pour using thermal connections. PCB designers today almost invariably use completely solid areas of copper pour that completely cover the remaining area outside those tracks, pads, and stand-off regions.Many early PCBs have a "hatched copper pour", sometimes called a "cherry pie lattice". While solid copper pour provides better resistive characteristics,hatched copper pour is used to balance the heat and dilatation on both sides of the board in order to avoid warping of certain substrate.Heating might cause gas bubbles between solid copper pour and certain substrates. Furthermore, it might be possible to adjust the impedance of high frequency traces by using hatched copper pour in order to reach better signal quality.
http://purl.org/voc/vrank#hasRank
is Link from a Wikipage to another Wikipage of
is foaf:primaryTopic of
Faceted Search & Find service v1.17_git39 as of Aug 09 2019


Alternative Linked Data Documents: PivotViewer | iSPARQL | ODE     Content Formats:       RDF       ODATA       Microdata      About   
This material is Open Knowledge   W3C Semantic Web Technology [RDF Data] Valid XHTML + RDFa
OpenLink Virtuoso version 07.20.3235 as of Jun 25 2020, on Linux (x86_64-generic-linux-glibc25), Single-Server Edition (61 GB total memory)
Data on this page belongs to its respective rights holders.
Virtuoso Faceted Browser Copyright © 2009-2020 OpenLink Software